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美國半導體產(chǎn)業(yè)協(xié)會(huì )：Q2及6月全球芯片銷(xiāo)售額均同比下滑16.8%

美國半導體產(chǎn)業(yè)協(xié)會(huì )：Q2及6月全球芯片銷(xiāo)售額均同比下滑16.8%

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人工智能朗讀：

8月5日，美國半導體產(chǎn)業(yè)協(xié)會(huì )（Semiconductor Industry Association，簡(jiǎn)稱(chēng)：SIA）公布，今年第二季全球芯片銷(xiāo)售額較去年同期減少16.8%至982億美元，6月銷(xiāo)售額減少16.8%至327億美元，已連續三個(gè)季度負增長(cháng)。

智通財經(jīng)APP獲悉，8月5日，美國半導體產(chǎn)業(yè)協(xié)會(huì )（Semiconductor Industry Association，簡(jiǎn)稱(chēng)：SIA）公布，今年第二季全球芯片銷(xiāo)售額較去年同期減少16.8%至982億美元，6月銷(xiāo)售額減少16.8%至327億美元，已連續三個(gè)季度負增長(cháng)。

SIA總裁兼執行長(cháng)John Neuffer在聲明中指出，2019年上半年，全球半導體銷(xiāo)售仍處于下滑趨勢，同比下滑14.5%。（陳雨）


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