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三季度全球半導體銷(xiāo)售額創(chuàng )新高，中芯國際反彈超6%

三季度全球半導體銷(xiāo)售額創(chuàng )新高，中芯國際反彈超6%

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人工智能朗讀：

據半導體產(chǎn)業(yè)協(xié)會(huì )(SIA)數據顯示，今年第三季全球半導體銷(xiāo)售額創(chuàng )歷史新高，達到1227億美元，較上一季增長(cháng)4.1%、年增13.8%。今年9月半導體銷(xiāo)售額也刷新紀錄，年增超過(guò)13%。

智通財經(jīng)APP獲悉，三季度全球半導體銷(xiāo)售額年增逾13%，創(chuàng )歷史新高，半導體板塊全線(xiàn)反彈。截至14時(shí)37分，先進(jìn)半導體(03355)漲50%，報1.35港元，中芯國際(00981)漲6.68%，報價(jià)6.39港元，ASM太平洋(00522)漲5.39%，報67.4港元，華虹半導體(01347)漲4.98%，報13.5港元。

據半導體產(chǎn)業(yè)協(xié)會(huì )(SIA)數據顯示，今年第三季全球半導體銷(xiāo)售額創(chuàng )歷史新高，達到1227億美元，較上一季增長(cháng)4.1%、年增13.8%。今年9月半導體銷(xiāo)售額也刷新紀錄，年增超過(guò)13%。（王岳川）

[責任編輯：江書(shū)劍]

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